According to a market report by Lucintel, the future of the global automatic silver sintering die attach machine market looks promising with opportunities in the power semiconductor device, rf power device, and high performance led markets. The global automatic silver sintering die attach machine market is expected to grow with a CAGR of 7.1% from 2025 to 2031. The major drivers for this market are the increasing demand for high power devices, the rising use in advanced packaging technologies, and the growing need for thermal management solutions.A more than 150-page report to understand trends, opportunity and forecast in automatic silver sintering die attach machine market to 2031 by type (fully automatic and semi-automatic), application (power semiconductor device, rf power device, high performance led, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World).
Lucintel forecasts that, within the type category, fully automatic is expected to witness higher growth over the forecast period.
Within the application category, power semiconductor device, RF power device, and high performance LED is expected to witness the highest growth.
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In terms of region, APAC is expected to witness the highest growth over the forecast period.
Boschman, ASMPT, AMX Automatrix, NIKKISO, PINK GmbH Thermosysteme, Zhuhai Silicon Cool Technology, Shenzhen Advanced Joining, Quick Intelligent Equipment, ChenglianKaida Technology, JH Advanced Semiconductor are the major suppliers in the automatic silver sintering die attach machine market.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or write us at [email protected]To get access of more than 1000 reports at fraction of cost visit Lucintel'sAnalytics Dashboard.
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Contact:
Roy Almaguer
Lucintel
Dallas, Texas, USA
Email: [email protected]
Tel. +1-972-636-5056
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